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Plating Baths for Electronics

High-performance liquid chromatography (HPLC) and ion chromatography (IC) are efficient analytical techniques that can be used to quickly determine both trace and major constituents of a wide variety of electroplating solutions, acid etchants, conversion coatings, cleaning solutions, and the various rinses and wastewaters derived from these solutions. These techniques provide a convenient means of quantifying common inorganic anions and cations, certain organic additives, transition metals, polyvalent ions, and organic chelating agents.

Accurate and frequent monitoring of the plating process can result in significant savings due to reduced scrap rate, reduced bath solution losses, and improved quality. HPLC and IC can also be used for other applications, such as environmental compliance monitoring, quality control of raw material chemicals, and routine sample analysis.

As specifications for plated products become tighter and the cost of producing high-quality products rises, manufacturers need to better understand the critical balances in plating solutions and their impact on the deposit quality. Improved analytical techniques for characterizing plating solutions help manufacturers tighten control of process chemistries. The result is improved production efficiency and overall profitability.